RANsemi and SOLiD to Present Scalable 5G NTN Processor Architecture at SATShow 2027

UK semiconductor manufacturer RANsemi and Korean telecoms OEM SOLiD have announced plans to present a scalable, AI-native system-on-chip (SoC) architecture for 5G non-terrestrial networks (NTN) at SATShow 2027 in Washington, DC. The proposed design is intended to support both satellite user terminals and digital regenerative payloads through a common processing architecture.

The approach will use a chiplet-based processor array that can scale from compact, low-power NTN terminals to more complex, multi-chip satellite payload systems. By maintaining a shared hardware and software framework across different configurations, the companies aim to simplify development and enable processing resources to be adapted to varying performance requirements.

RANsemi will outline the underlying processor-array and SoC architecture, while SOLiD will examine its potential application to 5G NTN terminals and regenerative satellite payloads. Regenerative payloads process communications signals on board the satellite rather than simply relaying them to ground infrastructure, creating additional requirements for flexible and efficient digital processing.

The presentation reflects growing interest in modular, software-defined processing architectures for satellite communications, particularly as 5G NTN systems move towards greater integration with terrestrial mobile networks. A scalable chiplet approach could allow equipment manufacturers to reuse processing technology across ground terminals and space-based systems, potentially reducing development complexity and supporting future network upgrades.

The companies’ joint technical session, titled Extensible AI-Native Processor-Array Architecture for Scalable 5G NTN Satellite Terminals and Digital Regenerative Payloads, will take place on 9 March 2027.